Transfer substrate, display panel and transfer method

ABSTRACT

Provided are a transfer substrate, a display panel and a transfer method. The transfer substrate includes a plurality of object setting regions arranged in an array, the plurality of object setting regions including n types, where n is a positive integer, and n≥2. The transfer substrate further includes: a base substrate, and a blocking layer located on a side of the base substrate. The blocking layer forms accommodating grooves respectively within object setting regions. Phase change materials are provided in accommodating grooves of at least (n−1) types of object setting regions. The provided transfer substrate has a simple structure and high transfer efficiency.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Chinese Patent Application No.202010622522.0 filed Jun. 30, 2020, the disclosure of which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the technical field of displaytechnologies and, in particular, to a transfer substrate, a displaypanel and a transfer method.

BACKGROUND

If the massive transfer of different types of objects is desired to beachieved, the method of one-by-one transfer is generally adopted in theexisting art. Exemplarily, for the massive transfer of MicroLight-Emitting Diodes (Micro LEDs) in a Micro LED display panel in thefield of display technologies in the existing art, a transfer head ismade for LED chip particles to be transferred from a native substrate toa substrate having a driving circuit. The transfer technology in theexisting art is complex in process, low in efficiency and high in cost.

SUMMARY

In view of the above matter, a transfer substrate, a display panel and atransfer method are provided in the present disclosure. The structuresare simple and the transfer efficiency is high.

In a first aspect, a transfer substrate is provided in the presentdisclosure and includes a plurality of object setting regions which arearranged in an array and configured to place objects to be placed. Theplurality of object setting regions include n types, where n is apositive integer, and n≥2.

The transfer substrate further includes: a base substrate, and ablocking layer located on a side of the base substrate, where theblocking layer forms accommodating grooves respectively within theplurality of object setting regions.

Phase change materials are provided in accommodating grooves of at least(n−1) types of object setting regions.

In a second aspect, a display panel is further provided in the presentdisclosure and includes an array substrate, a pixel driving circuitarray and an insulating layer. The array substrate includes a basesubstrate. The base substrate includes a plurality of sub-pixel settingregions arranged in an array.

The pixel driving circuit array is located on a side of the basesubstrate.

The insulating layer is located on a side of the pixel driving circuitarray facing away from the base substrate. The pixel driving circuitarray includes pixel driving circuits arranged in an array. Theinsulating layer forms accommodating grooves respectively within of theplurality of sub-pixel setting regions. The pixel driving circuits aredisposed in one-to-one correspondence with accommodating grooves.

The display panel further includes data lines and heating lines, whereeach of the data lines is electrically connected to a respective columnof pixel driving circuits among a plurality of columns of pixel drivingcircuits arranged in the array.

The data lines are multiplexed as the heating line; in a preparationstage, the data lines serve as the heating line to enable light-emittingelements to be transferred to the accommodating grooves; in a displaystage, the data lines are configured to provide signals for the pixeldriving circuits so that the pixel driving circuits are able to generatecurrents for driving the light-emitting elements to emit light.

Alternatively, the heating line and the data lines are disposed at asame layer.

In a phase change stage, the heating line enables light-emittingelements to be transferred to the accommodating grooves.

In a data writing phase, the data lines are configured to providesignals for the pixel driving circuits so that the pixel drivingcircuits are able to generate currents for driving the light-emittingelements to emit light.

In a third aspect, a transfer method is further provided in the presentdisclosure and includes steps described below.

In S1, a transfer substrate is provided. The transfer substrate includesa plurality of object setting regions which are arranged in an array andconfigured to place objects to be placed, and the plurality of objectsetting regions includes n types, where n is a positive integer, andn≥2. The transfer substrate further includes: a base substrate, and ablocking layer located on a side of the base substrate, where theblocking layer forms accommodating grooves respectively within theplurality of object setting regions. Phase change materials are providedin accommodating grooves of at least (n−1) types of object settingregions.

In S2, phase change materials in accommodating grooves of an i-th typeof object setting regions are controlled to be subjected to phase changefrom a solid state to a liquid state or a gas state, and the transfersubstrate is placed in an i-th type of to-be-placed object suspension toenable an i-th type of to-be-placed objects to fall into theaccommodating grooves corresponding to the phase change materialssubjected to the phase change to the liquid state or the gas state.

In S3, the step S2 is circularly performed until corresponding types ofto-be-placed objects fall into all accommodating grooves of the ndifferent types of object setting regions.

i is a positive integer less than or equal to n.

According to the transfer substrate, the display panel and the transfermethod provided in the present disclosure, phase change materials areprovided in the accommodating grooves of object setting regions, so thatwhen no to-be-placed object needs to be transferred, the phase changematerials are provided in the accommodating grooves of the objectsetting regions, and when the to-be-placed objects need to betransferred, the phase change materials in all the accommodating groovesof one type of object setting regions are subjected to phase change, forexample, from a solid state to a liquid state or a gas state. At thistime, a plurality of to-be-placed objects corresponding to the one typeof object setting regions can be provided at one time in the pluralityof accommodating grooves in which phase change occurs, and otheraccommodating grooves cannot be provided with to-be-placed objects dueto the fact that phase change materials are provided in these otheraccommodating grooves. In this way, transfer of one type of to-be-placedobjects at one time is achieved, and finally all n types of to-be-placedobjects are placed in the corresponding accommodating grooves. Throughthe transfer substrate of the embodiments, massive transfer of differenttypes of to-be-placed objects can be quickly achieved, the transferperiod is shortened, and the transfer efficiency is improved.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic structural view of a transfer substrate accordingto an embodiment of the present disclosure;

FIG. 2 is a sectional view taken along a line AN of FIG. 1;

FIG. 3 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 4 is a sectional view taken along a line CC′ of FIG. 3;

FIG. 5 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 6 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 7 is a schematic structural view of a film structure of anothertransfer substrate according to an embodiment of the present disclosure;

FIG. 8 is a schematic view of another transfer substrate according to anembodiment of the present disclosure;

FIG. 9 is a schematic view of a film structure of another transfersubstrate according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural view of a film structure of anothertransfer substrate according to an embodiment of the present disclosure;

FIG. 11 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 12 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 13 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 14 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 15 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 16 is a schematic structural view of another transfer substrateaccording to an embodiment of the present disclosure;

FIG. 17 is an enlarged view of the pixel driving circuit of FIG. 16;

FIG. 18 is a schematic view of a film structure of another transfersubstrate according to an embodiment of the present disclosure;

FIG. 19 is a schematic view of a film structure of another transfersubstrate according to an embodiment of the present disclosure;

FIG. 20 is a schematic structural view of a display panel according toan embodiment of the present disclosure;

FIG. 21 is a schematic view of a film structure of a display panelaccording to an embodiment of the present disclosure;

FIG. 22 is a schematic structural view of another display panelaccording to an embodiment of the present disclosure;

FIG. 23 is a schematic view of a film structure of another display panelaccording to an embodiment of the present disclosure;

FIG. 24 is a schematic structural view of another display panelaccording to an embodiment of the present disclosure;

FIG. 25 is a schematic view of another display panel according to anembodiment of the present disclosure;

FIG. 26 is a schematic structural view of another display panelaccording to an embodiment of the present disclosure;

FIG. 27 is a flowchart of a transfer method according to an embodimentof the present disclosure; and

FIG. 28 is a flowchart of another transfer method according to anembodiment of the present disclosure.

DETAILED DESCRIPTION

To make the objects, technical solutions and advantages of the presentdisclosure clearer, the technical solutions of the present disclosurewill be completely described below in conjunction with the specificembodiments and the drawings in the embodiments of the presentdisclosure. Apparently, the described embodiments are part, not all, ofthe embodiments of the present disclosure, and based on the embodimentsof the present disclosure, other embodiments obtained by those skilledin the art on the premise that no creative work is done are within thescope of the present disclosure.

In view of the problem mentioned in BACKGROUND, a transfer substrate isprovided in the embodiments of the present disclosure. The transfersubstrate includes a plurality of object setting regions arranged in anarray, the plurality of object setting regions including n types, wheren is a positive integer, and n≥2. The transfer substrate furtherincludes: a base substrate, and a blocking layer located on a side ofthe base substrate. The blocking layer forms accommodating groovesrespectively within object setting regions. Phase change materials areprovided in accommodating grooves of at least (n−1) types of objectsetting regions.

With the above technical solution, phase change materials are providedin the accommodating grooves of object setting regions, so that when noto-be-placed object needs to be transferred, the phase change materialsare provided in the accommodating grooves of the object setting regions,and when the to-be-placed objects need to be transferred, the phasechange materials in all the accommodating grooves of one type of objectsetting regions are subjected to phase change, for example, from a solidstate to a liquid state or a gas state. At this time, a plurality ofto-be-placed objects corresponding to the one type of object settingregions can be provided at one time in the plurality of accommodatinggrooves in which phase change occurs, and other accommodating groovescannot be provided with to-be-placed objects due to the fact that phasechange materials are provided in these other accommodating grooves. Inthis way, transfer of one type of to-be-placed objects at one time isachieved, and finally all n types of to-be-placed objects are placed inthe corresponding accommodating grooves. Through the transfer substrateof the embodiments, massive transfer of different types of to-be-placedobjects can be quickly achieved, the transfer period is shortened, andthe transfer efficiency is improved.

The above is the core idea of the present disclosure, and technicalsolutions in the embodiments of the present disclosure will be describedclearly and completely in conjunction with the drawings in theembodiments of the present disclosure. On the basis of the embodimentsof the present disclosure, all other embodiments obtained by thoseskilled in the art without creative work are within the scope of theembodiments of the present disclosure.

FIG. 1 is a schematic structural view of a transfer substrate accordingto an embodiment of the present disclosure, and FIG. 2 is a sectionalview taken along a line AA′ of FIG. 1. As shown in FIG. 1 and FIG. 2, atransfer substrate 100 includes a plurality of object setting regions BBwhich are arranged in an array and configured to place objects to beplaced, the plurality of object setting regions including n types, wheren is a positive integer, and n≥2; the transfer substrate 100 furtherincludes a base substrate 10 and a blocking layer 20 located on a sideof the base substrate 10, where the blocking layer 20 formsaccommodating grooves 30 respectively within object setting regions BB,and phase change materials 40 are provided in accommodating grooves 30of at least (n−1) types of object setting regions BB.

Specifically, the phase change material 40 corresponds to differentstates of matter, such as a liquid state, a solid state, or even a gasstate, at different temperatures.

Specifically, the plurality of object setting regions includes n types,and different types of object setting regions BB are used fortransferring different types of to-be-placed objects. Phase changematerials 40 are provided in the accommodating grooves 30 of the atleast (n−1) types of object setting regions BB, so that when noto-be-placed object needs to be transferred, the phase change materials40 are provided in the accommodating grooves 30 of the at least (n−1)types of object setting regions BB, and the phase change materials arein a solid state at the moment. When n types of to-be-placed objectsneed to be transferred, that is, n types of to-be-placed objects need tobe provided in the accommodating grooves 30 of all the object settingregions BB, two cases are described below. If the accommodating grooves30 of the n types of object setting regions BB are all provided with thephase change materials 40, phase change materials 40 in theaccommodating grooves 30 of one type of object setting regions BB areall made to be subjected to phase change, for example, to a liquid or agas, and since solid phase change materials are provided in otheraccommodating grooves 30, to-be-placed objects cannot be provided inthese other accommodating grooves 30. At this time, a plurality ofto-be-placed objects corresponding to the one type of object settingregions BB can be provided at one time in the plurality of accommodatinggrooves 30 in which phase change occurs, and thus transfer of one typeof to-be-placed objects are achieved, and finally all the n types ofto-be-placed objects are placed in accommodating grooves. If phasechange materials 40 are provided in the accommodating grooves 30 of(n−1) types of object setting regions BB, that is, one type of objectsetting regions BB is not provided with phase change materials 40,firstly, a plurality of to-be-placed objects of the same type areprovided at one time in all the accommodating grooves 30 which areprovided with no phase change material, and then phase change materials40 in the accommodating grooves 30 of a second type of object settingregions BB are made to be subjected to phase change. At this time, aplurality of to-be-placed objects of a second type can be provided atone time in the plurality of accommodating grooves 30 in which the phasechange occurs, and thus the transfer of the second type of to-be-placedobjects are achieved, and finally all the n types of to-be-placedobjects are placed in the accommodating grooves 30. In this way, themassive transfer of different types of to-be-placed objects are quicklyachieved, the transfer period is shortened, and the transfer efficiencyis improved.

Exemplarily, with continued reference to FIGS. 1 and 2, n is three, thatis, the plurality of object setting regions BB includes three types, andaccordingly, three types of to-be-placed objects need to be placed, andthe types of the to-be-placed objects are in one-to-one correspondencewith the types of the object setting regions BB, where phase changematerials 40 are provided in the accommodating grooves 30 of two typesof object setting regions BB. Specifically, the three types of objectsetting regions BB include a first type of object setting regions BB1, asecond type of object setting regions BB2, and a third type of objectsetting regions BB3. No phase change material 40 is provided in theaccommodating grooves 30 of the first type of object setting regionsBB1. Phase change materials 40 are separately provided in theaccommodating grooves 30 of the second type of object setting regionsBB2 and the third type of object setting regions BB3. Specifically, whenthree types of to-be-placed objects need to be transferred, that is,three types of to-be-placed objects need to be provided in theaccommodating grooves 30 of all the object setting regions BB, firstly,the first type of to-be-placed objects are provided at one time in theaccommodating grooves 30 of the first type of object setting regions BB1which are not provided with the phase change materials to finish thetransfer of the first type of to-be-placed objects; then phase changematerials 40 in the accommodating grooves 30 of the second type ofobject setting regions BB2 are made to be subjected to phase change, andthe second type of to-be-placed objects are provided at one time in theaccommodating grooves 30 of the second type of object setting regionsBB2 to finish the transfer of the second type of to-be-placed objects;and finally, phase change materials 40 in the accommodating grooves 30of the third type of object setting regions BB3 are made to be subjectedto phase change, and the third type of to-be-placed objects are providedat one time in the accommodating grooves 30 of the third type of objectsetting regions BB3 to finish the transfer of the third type ofto-be-placed objects. In this way, transfer of all the three types ofto-be-placed objects are completed.

Exemplarily, FIG. 3 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, FIG. 4is a sectional view taken along a line CC′ of FIG. 3, and as shown inFIGS. 3 and 4, n is three, that is, the plurality of object settingregions BB includes three types, and accordingly, three types ofto-be-placed objects need to be placed, and the types of theto-be-placed objects are in one-to-one correspondence with the types ofthe object setting regions BB, where phase change materials 40 areprovided in all the accommodating grooves 30 of the three types ofobject setting regions BB. Specifically, the three types of objectsetting regions BB include a first type of object setting regions BB1, asecond type of object setting regions BB2, and a third type of objectsetting regions BB3. Specifically, when three types of to-be-placedobjects need to be transferred, that is, three types of to-be-placedobjects need to be provided in the accommodating grooves 30 of all theobject setting regions BB, firstly, phase change materials 40 in theaccommodating grooves 30 of the first type of object setting regions BB1are made to be subjected to phase change, and the first type ofto-be-placed objects are provided at one time in the accommodatinggrooves 30 of the first type of object setting regions BB1 to finish thetransfer of the first type of to-be-placed objects; then phase changematerials 40 in the accommodating grooves 30 of the second type ofobject setting regions BB2 are made to be subjected to phase change, andthe second type of to-be-placed objects are provided at one time in theaccommodating grooves 30 of the second type of object setting regionsBB2 to finish the transfer of the second type of to-be-placed objects;and finally, phase change materials 40 in the accommodating grooves 30of the third type of object setting regions BB3 are made to be subjectedto phase change, and the third type of to-be-placed objects are providedat one time in the accommodating grooves 30 of the third type of objectsetting regions BB3 to finish the transfer of the third type ofto-be-placed objects. In this way, transfer of all the three types ofto-be-placed objects is completed.

Optionally, the base substrate 10 has a supporting and protectingfunction for other structures in the transfer substrate 100. The basesubstrate 10 may be a rigid base substrate or a flexible base substrate.When the base substrate is a rigid base substrate, the base substrate 10may be, for example, glass or the like; when the base substrate 10 is aflexible base substrate, the base substrate may be, for example,polyimide or the like.

Optionally, the phase change material 40 may include, for example, anyone of water, disodium hydrogen phosphate dodecahydrate, lauric acid, orcalcium chloride hexahydrate. It should be noted that the phase changematerial 40 in the embodiment is not limited to the above examples, anda method may be used as long as the transfer of the to-be-placed objectscan be achieved through phase change of the phase change material 40.The temperatures of different types of object setting regions BB arecontrolled so that different phase change materials 40 can be filled inthe object setting regions BB in a preset state, for example, the phasechange materials 40 are in a solid state in the object setting regionsBB.

It can be understood that the phase change temperature of the blockinglayer 20 needs to be greater than the phase change temperatures of allthe phase change materials 40 provided in the different types of objectsetting regions BB, avoiding the problem that the transfer ofto-be-placed objects is affected due to the fact that the blocking layer20 is also subjected to phase change when the phase change materials 40provided in the different types of object setting regions BB aresubjected to phase change.

Optionally, the material of the blocking layer 20 may include, forexample, at least one of epoxy resin, polycarbonate, polyimide,polymethyl methacrylate, or the like.

Optionally, the material of the blocking layer 20 is the same as thematerial of the base substrate 10. When the material of the blockinglayer 20 is the same as the material of the base substrate 10, theblocking layer 20 and the base substrate 10 may be integrally formed,simplifying the process steps. In summary, according to the transfersubstrate provided in the embodiment of the present disclosure, phasechange materials are provided in the accommodating grooves of objectsetting regions, so that when no to-be-placed object needs to betransferred, the phase change materials are provided in theaccommodating grooves of the object setting regions, and when theto-be-placed objects need to be transferred, the phase change materialsin all the accommodating grooves of one type of object setting regionsare subjected to phase change. At this time, a plurality of to-be-placedobjects corresponding to the one type of object setting regions can beprovided at one time in the plurality of accommodating grooves in whichphase change occurs, and other accommodating grooves cannot be providedwith to-be-placed objects due to the fact that phase change materialsare provided in these other accommodating grooves. In this way, transferof the one type of to-be-placed objects at one time is achieved, andfinally all n types of to-be-placed objects are placed in thecorresponding accommodating grooves. Through the transfer substrate ofthe embodiment, massive transfer of different types of to-be-placedobjects can be quickly achieved, the transfer period is shortened, andthe transfer efficiency is improved.

Optionally, the plurality of object setting regions includes n types oflight-emitting element setting regions with different wavebands.

The n types of light-emitting element setting regions with differentwavebands are used for transferring light-emitting elements with nwavebands. The light-emitting element may include, for example, a MicroLED or a Mini Light Diode (Mini LED). For example, the light-emittingelement is a Micro LED, that is, a massive number of Micro LEDs aretransferred, i.e., Micro LEDs of different colors are transferred to atransfer substrate, and the Micro LEDs of different colors aretransferred to preset positions in a target substrate at one timethrough the transfer substrate.

Exemplarily, FIG. 5 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 5, a plurality of object setting regions BB includes afirst Micro LED setting region DD1, a second Micro LED setting regionDD2 and a third Micro LED setting region DD3. The first Micro LEDsetting region DD1 is used for transferring the first Micro LED, wherethe light-emitting color of the first Micro LED is a first color, andthe first color may be, for example, red. The second Micro LED settingregion DD2 is used for transferring the second Micro LED, where thelight-emitting color of the second Micro LED is a second color, and thesecond color may be, for example, green. The third Micro LED settingregion DD3 is used for transferring the third Micro LED, where thelight-emitting color of the third Micro LED is a third color, and thethird color may be, for example, blue. The first Micro LED settingregions DD1, the second Micro LED setting regions DD2, and the thirdMicro LED setting regions DD3 are each provided with the phase changematerial 40. Specifically, when massive numbers of first Micro LEDs,second Micro LEDs and third Micro LEDs need to be transferred, that is,the first Micro LEDs, the second Micro LEDs and the third Micro LEDsneed to be placed in the accommodating grooves 30 of all the objectsetting regions BB, firstly, phase change materials 40 in theaccommodating grooves 30 of the first Micro LED setting regions DD1 aremade to be subjected to phase change, and the first Micro LEDs areprovided at one time in the accommodating grooves 30 of the first MicroLED setting regions DD1 to finish the transfer of the first Micro LEDs.Then, phase change materials 40 in the accommodating grooves 30 of thesecond Micro LED setting regions DD2 are made to be subjected to phasechange, and the second Micro LEDs are provided at one time in theaccommodating grooves 30 of the second Micro LED setting regions DD2 tofinish the transfer of the second Micro LEDs. Finally, phase changematerials 40 in the accommodating grooves 30 of the third Micro LEDsetting regions DD3 are made to be subjected to phase change, and thethird Micro LEDs are provided at one time in the accommodating grooves30 of the third Micro LED setting regions DD3 to finish the transfer ofthe third Micro LEDs. In this way, transfer of all the Micro LEDs arecompleted, that is, all Micro LEDs of three colors are transferred tothe transfer substrate 100, and then the Micro LEDs of different colorsare transferred to the preset positions in the target substrate at onetime through the transfer substrate 100, thus improving the efficiencyof massive transfer of Micro LEDs and ensuring relatively high transferyield.

It should be noted that the above embodiment takes the transfer of MicroLEDs as an example, but does not constitute a limitation to the presentdisclosure, and a method may be used as long as transfer of n types oflight-emitting elements with different wavebands can be achieved.

Optionally, when n≥3, phase change temperatures of phase changematerials provided in accommodating grooves of different types of objectsetting regions are different.

Exemplarily, with continued reference to FIG. 3, the plurality of objectsetting regions BB includes three types, and the three types of objectsetting regions BB include a first type of object setting regions BB1, asecond type of object setting regions BB2, and a third type of objectsetting regions BB3; a first phase change material 41 is provided in theaccommodating groove 30 of the first type object setting region BB1, andthe phase change temperature of the first phase change material 41 is40° C.; a second phase change material 42 is provided in theaccommodating groove 30 of the second type object setting region BB2,and the phase change temperature of the second phase change material 42is 50° C.; a third phase change material 43 is provided in theaccommodating groove 30 of the third type object setting region BB3, andthe phase change temperature of the third phase change material 43 is60° C. Specifically, when three types of to-be-placed objects need to betransferred, that is, three types of to-be-placed objects need to beprovided in the accommodating grooves 30 of all the object settingregions BB, the temperature of the environment where the transfersubstrate 100 is located is controlled to be 40° C., and thus, firstphase change materials 41 in the accommodating grooves 30 of the firsttype of object setting regions BB1 are subjected to phase change, forexample, from a solid state to a gas state or a liquid state, and thenthe first third type of to-be-placed objects are provided at one time inthe accommodating grooves 30 of the first type of object setting regionsBB1 to finish the transfer of the first third type of to-be-placedobjects. Then, the temperature of the environment where the transfersubstrate 100 is located is controlled to be 50° C., and thus, secondphase change materials 42 in the accommodating grooves 30 of the secondtype of object setting regions BB2 are subjected to phase change, forexample, from a solid state to a gas state or a liquid state. At thistime, since the first third type of to-be-placed objects has alreadybeen provided in the accommodating grooves 30 of the first type ofobject setting regions BB1 and third phase change materials 43 in theaccommodating grooves 30 of the third type of object setting regions BB3cannot be subjected to phase change at 50° C., that is, are still in thesolid state, the second type of to-be-placed objects can be provided atone time in the accommodating grooves 30 of the second type of objectsetting regions BB2 to finish the transfer of the second type ofto-be-placed objects. Finally, the temperature of the environment wherethe transfer substrate 100 is located is controlled to be 60° C., andthus, the third phase change materials 43 in the accommodating grooves30 of the third type of object setting regions BB3 are subjected tophase change, for example, from a solid state to a gas state or a liquidstate. At this time, since the first third type of to-be-placed objectshas already been provided in the accommodating grooves 30 of the firsttype of object setting regions BB1 and the second type of to-be-placedobjects has already been provided in the accommodating grooves 30 of thesecond type of object setting regions BB2, the third type ofto-be-placed objects can be provided at one time in the accommodatinggrooves 30 of the third type of object setting regions BB3 to finish thetransfer of the third type of to-be-placed objects. In this way,transfer of the three types of to-be-placed objects is completed.

It should be noted that in the above example, the phase change of thephase change material is achieved through a control of the temperatureof the environment where the transfer substrate 100 is located, but suchmethod does not constitute a limitation to the present disclosure, and amethod may be used as long as the transfer of the to-be-placed objectscan be achieved through the phase change of the phase change material.For example, the temperature of the base substrate 10 and the like canbe controlled to achieve the purpose of phase change of the phase changematerial.

Optionally, no phase change material is provided in accommodatinggrooves of a j-th type of object setting regions, where j is a positiveinteger less than or equal to n.

With continued reference to FIG. 1, when no phase change material isprovided in the accommodating grooves of the j-th type of object settingregions, the to-be-placed objects corresponding to the j-th type ofobject setting regions can be transferred first, and then other types ofto-be-placed objects are transferred. FIG. 1 illustrates, by way ofexample, that no phase change material is provided in the accommodatinggrooves 30 of merely the first type of object setting regions BB1.Optionally, the case may also be that no phase change material isprovided in the accommodating grooves 30 of merely the second type ofobject setting region BB2 (not shown in the figure) or that no phasechange material is provided in the accommodating grooves 30 of merelythe third type of object setting regions BB3 (not shown in the figure).In the embodiment, the number of phase change materials 40 can bereduced and the cost is reduced.

Optionally, when n≥3, a difference between every two phase changetemperatures of phase change materials provided in accommodating groovesof the n types of object setting regions is greater than or equal to 4°C.

Such setting has the advantages of avoiding the problem that transfer ofthe to-be-placed objects is affected due to the fact that when one typeof phase change material is subjected to phase change, another type ofphase change material may also be subjected to phase change since thephase change temperature difference is small and improving thereliability of the transfer substrate.

Optionally, phase change materials are provided in accommodating groovesof all of n types of object setting regions; and phase changetemperatures of the phase change materials in all the accommodatinggrooves are the same.

Specifically, when the phase change temperatures of the phase changematerials in all the accommodating grooves are the same, the phasechange of the phase change materials in corresponding regions can becontrolled through a change of the temperature of a local region. Forexample, phase change materials are provided in accommodating grooves ofboth the two types of object setting regions; and phase changetemperatures of the phase change materials in all the accommodatinggrooves are the same. In this case, the temperatures of the first typeof object setting regions are first controlled to make the phase changematerials in the corresponding accommodating grooves be subjected tophase change. Since the temperatures of the second type of objectsetting regions are unchanged, the phase change materials in theaccommodating grooves of the second type of object setting regions arenot subjected to phase change, so that the transfer of the first type ofto-be-placed objects can be completed. Then, the temperatures of thesecond type of object setting regions are controlled to make the phasechange materials in the corresponding accommodating grooves be subjectedto phase change, so that the transfer of the second type of to-be-placedobjects is completed. In the embodiment, the phase change temperaturesof the phase change materials in the accommodating grooves are the same,so that the phase change materials can be simultaneously provided in theaccommodating grooves, thus simplifying the process steps.

Optionally, FIG. 6 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 6, the transfer substrate 100 further includes at leastone heating line 50 for controlling the phase change of phase changematerials 40.

Exemplarily, with continued reference to FIG. 6, when the phase changetemperatures of the phase change materials 40 provided in theaccommodating grooves of different types of object setting regions BBare different, different temperatures can be provided by a heating line50 separately, so that the phase change materials 40 provided in theaccommodating grooves of different types of object setting regions BBare separately subjected to phase change according to the temperatureprovided by the heating line 50.

Exemplarily, FIG. 7 is a schematic view of a film structure of atransfer substrate according to an embodiment of the present disclosure,and as shown in FIG. 7, a heating line 50 is provided on the entiresurface of one side of the base substrate 10 facing away from theblocking layer 20; when the phase change temperatures of the phasechange materials 40 provided in the accommodating grooves 30 ofdifferent types of object setting regions BB are different, differenttemperatures can be separately provided by the heating line 50 on theentire surface, so that the phase change materials 40 provided in theaccommodating grooves of the different types of object setting regionsBB are separately subjected to phase change according to the temperatureprovided by the heating line 50. Since the heating line 50 is disposedon the entire surface, the heating line 50 can uniformly provide thephase change temperature for the phase change materials 40, i.e., theconsistency of phase change of the phase change materials 40 provided inthe accommodating grooves 30 of the same type of to-be-placed settingregions BB is improved. For example, for transfer of two types ofto-be-placed objects, accordingly, different types of object settingregions BB include a first type of object setting regions BB1 and asecond type of object setting regions BB2; no phase change material 40is provided in the accommodating grooves corresponding to the first typeof object setting regions BB1, and phase change materials 40 areprovided in the accommodating grooves corresponding to the second typeof object setting regions BB2; firstly, a plurality of to-be-placedobjects of the same type are provided at one time in all theaccommodating grooves 30 which are provided with no phase changematerial, and then phase change materials 40 in the accommodatinggrooves 30 of the second type of object setting region BB2 arecontrolled to be simultaneously subjected to phase change through theheating line 50 on the entire surface; at this time, a plurality ofto-be-placed objects of a second type can be provided at one time in theplurality of accommodating grooves 30 in which the phase change occurs,and thus the transfer of the second type of to-be-placed objects isachieved. Exemplarily, FIG. 8 is a schematic structural view of anothertransfer substrate according to an embodiment of the present disclosure,and as shown in FIG. 8, when the phase change temperatures of the phasechange materials 40 in all the accommodating grooves are the same, aplurality of heating lines 50 is provided and separately provides thephase change temperatures for the phase change materials 40 in theaccommodating grooves of different types of object setting regions BB tomake the phase change materials 40 in the accommodating grooves ofobject setting regions BB corresponding to a heating line 50 besubjected to phase change.

It should be noted that the embodiment does not limit the specificposition of the heating line. Optionally, FIG. 9 is a schematic view ofa film structure of a transfer substrate according to an embodiment ofthe present disclosure, and as shown in FIG. 9, a heating line 50 islocated between the base substrate 10 and the blocking layer 20. Sincethe heating line 50 is relatively adjacent to the phase change material40, the efficiency of phase change of the phase change material 40 canbe improved. Optionally, FIG. 10 is a schematic structural view of afilm structure of another transfer substrate according to an embodimentof the present disclosure, and as shown in FIG. 10, the heating line 50may further be located on a side of the base substrate 10 facing awayfrom the blocking layer 20. Optionally, the heating line may not be onthe transfer substrate (not shown in the figure), but the temperature atthe position of the phase change material can be controlled.

Optionally, FIG. 11 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 11, phase change materials 40 provided in accommodatinggrooves of a same type of object setting regions are controlled by asame heating line 50 to be subjected to phase change.

Exemplarily, the plurality of object setting regions BB includes threetypes, and the three types of object setting regions BB include a firsttype of object setting regions BB1, a second type of object settingregions BB2, and a third type of object setting regions BB3; the phasechange materials 40 in the different types of object setting regions BBmay be the same, i.e., the phase change temperatures being the same, andmay be different, i.e., the phase change temperatures being different,and by way of example, the phase change materials 40 in different typesof object setting regions BB are different in FIG. 10, and the phasechange temperatures are a first temperature, a second temperature and athird temperature, respectively; the phase change materials 40 providedin the accommodating grooves 30 of the first type of object settingregions BB1 are controlled by a first heating line 51 to be subjected tophase change; the phase change materials 40 provided in theaccommodating grooves 30 of the second type of object setting regionsBB2 are controlled by a second heating line 52; and the phase changematerials 40 provided in the accommodating grooves of the third type ofobject setting regions BB3 are controlled by a third heating line 53 tobe subjected to phase change. Specifically, when three types ofto-be-placed objects need to be transferred, that is, three types ofto-be-placed objects need to be provided in the accommodating grooves 30of all the object setting regions BB, firstly, a first temperature isprovided by the first heating line 51 so that phase change materials 40in the accommodating grooves 30 of the first type of object settingregions BB1 are made to be subjected to phase change, and the firstthird type of to-be-placed objects are provided at one time in theaccommodating grooves 30 of the first type of object setting regions BB1to finish the transfer of the first third type of to-be-placed objects.Then, a second temperature is provided by the second heating line 52 sothat phase change materials 40 in the accommodating grooves 30 of thesecond type of object setting regions BB2 are made to be subjected tophase change, and the second type of to-be-placed objects are providedat one time in the accommodating grooves 30 of the second type of objectsetting regions BB2 to finish the transfer of the second type ofto-be-placed objects. Finally, a third temperature is provided by thethird heating line 53 so that phase change materials 40 in theaccommodating grooves 30 of the third type of object setting regions BB3are made to be subjected to phase change, and the third type ofto-be-placed objects are provided at one time in the accommodatinggrooves 30 of the third type of object setting regions BB3 to finish thetransfer of the third type of to-be-placed objects. In this way,transfer of the three types of to-be-placed objects is completed. In theembodiment, the phase change materials 40 provided in the accommodatinggrooves 30 of the same type of object setting regions BB are controlledby the same heating line 50 to be subjected to phase change. In thisway, for example, when the heating line 50 is provided with a signalthrough a chip to be enabled to provide a corresponding phase changetemperature, the number of chip terminals can be reduced, and chip costcan be saved. Meanwhile, the consistency of phase change of the phasechange materials 40 provided in the accommodating grooves of the sametype of object setting regions BB is ensured, and thus the consistencyof transferring the same type of to-be-placed objects to the transfersubstrate 100 is ensured.

Optionally, FIG. 12 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 12, among the plurality of object setting regions BBarranged in an array, phase change materials 40 provided inaccommodating grooves of a same type of object setting regions BBlocated in a same column or a same row are controlled by a same heatingline 50 to be subjected to phase change. In this way, the heating line50 are located in many regions, and the heating lines 50 located indifferent regions can be controlled independently, which is suitable fortransferring more than three types of object setting regions BB andflexible for control.

Optionally, with continued reference to FIG. 8, a heating line 50includes a first portion 501 and a second portion 502; a verticalprojection of the second portion 502 on a plane where the base substrate10 is located at least partially overlaps a vertical projection of theaccommodating groove on the plane where the base substrate 10 islocated. Alternatively, FIG. 13 is a schematic structural view ofanother heating line according to an embodiment of the presentdisclosure, and as shown in FIG. 13, at least part of a verticalprojection of the second portion 502 on a plane where the base substrate10 is located surrounds a vertical projection of the accommodatinggroove on the plane where the base substrate 10 is located.

It can be understood that since the phase change material 40 is providedin the accommodating groove, the position relationship between thevertical projection of the second portion 502 on the plane where thebase substrate 10 is located and the vertical projection of theaccommodating groove on the plane where the base substrate 10 is locatedis the position relationship between the vertical projection of thesecond portion 502 on the plane where the base substrate 10 is locatedand the vertical projection of the phase change material 40 on the planewhere the base substrate 10 is located. Therefore, FIGS. 7 and 12 merelyshow the phase change materials 40, and do not show the accommodatinggrooves.

Specifically, since the heating line 50 provides the phase changetemperature for the phase change material 40, the second portion 502 isdisposed directly above or directly below the phase change material 40or around the phase change material 40 in the embodiment, thus ensuringthe phase change speed of the phase change material 40 and furtherimproving the transfer speed.

Optionally, when the second portion 502 is disposed directly above thephase change material 40, the phase change temperature for the phasechange material 40 can be provided by providing an external heating line50, i.e., the heating line 50 is not disposed on the transfer substrate100, so as to ensure the phase change speed of the phase change material40. Optionally, a direct current voltage can be applied to the heatingline so that the heating line can provide a phase change temperature.Since the current in the same heating line is the same, the heatingpower can be provided through an increase in the resistance of thesecond portion of the heating line, thus improving the phase changespeed of the phase change material.

Optionally, FIG. 14 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 14, a resistance per unit length of the second portion 502is greater than a resistance per unit length of the first portion 501.

Specifically, it can be seen from R=(ρL)/S that the area of thecross-section of the second portion 502 on the plane perpendicular tothe column direction can be set to be smaller than the area of thecross-section of the first portion 501 on the plane perpendicular to thecolumn direction so that the resistance per unit length of the secondportion 502 is greater than the resistance per unit length of the firstportion 501.

Optionally, FIG. 15 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and asshown in FIG. 15, a shape of the vertical projection of the secondportion 502 on the plane where the base substrate 10 is located has atleast one of a straight line, a broken line, or a curved line.

Specifically, it can be seen from R=(ρL)/S that the length of the secondportion 502 can be increased so that the resistance of the secondportion 502 is greater than the resistance of the first portion 501.

It should be noted that by way of example, the vertical projection ofthe second portion on the plane where the base substrate 10 is locatedhas a shape of a broken line in FIG. 15. In other optional embodiments,the shape of the vertical projection may also be spiral, for example,continued reference is made to FIG. 13.

It can be understood that, in order to clearly show the shape of theheating line 50, FIGS. 14 and 15 merely show the heating line and do notshow the phase change material. Configuration in the followingembodiment is also same as the configuration described above. Repetitionwill not be made here.

Optionally, FIG. 16 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure, and FIG.17 is an enlarged view of the pixel driving circuit of FIG. 16. As shownin FIGS. 16 and 17, the transfer substrate 100 further includes a pixeldriving circuit array, the pixel driving circuit array is locatedbetween the blocking layer and the base substrate and includes pixeldriving circuits 60 arranged in an array, and the pixel driving circuits60 are in one-to-one correspondence with the accommodating grooves 30.

The transfer substrate 100 may be individually provided. That is, ntypes of to-be-placed objects are transferred to the transfer substrate100 first, and then are all transferred at one time to a targetsubstrate through the transfer substrate 100. That is, the to-be-placedobjects can be provided on the target substrate through two transfers.The to-be-placed object may be, for example, a Micro LED, andaccordingly, the target substrate may include, for example, a substratehaving a driving circuit. The array substrate in the display panel mayalso be multiplexed as the transfer substrate. Referring to FIG. 16, thearray substrate includes n types of light-emitting element settingregions DD with different wavebands. Phase change materials in theaccommodating grooves 30 of light-emitting element setting regions withthe same waveband are simultaneously subjected to phase change whilephase change materials in the accommodating grooves 30 of light-emittingelement setting regions with other wavebands are not subjected to phasechange, so that transfer of light-emitting elements with a correspondingwaveband is completed, and finally n types of light-emitting elementswith different wavebands are all provided in the accommodating grooves30 of the corresponding light-emitting element setting regions. That is,the light-emitting elements can be directly provided on the arraysubstrate through one transfer. The light-emitting element may be, forexample, a Micro LED. The transfer steps are simplified and the transferefficiency is further improved.

Optionally, with continued reference to FIGS. 16 and 17, a pixel drivingcircuit array further includes a plurality of data lines; each of theplurality of data lines is electrically connected to a respective columnof pixel driving circuits among a plurality of columns of pixel drivingcircuits 60 arranged in the array; and the data lines are multiplexed asthe heating lines 50.

The phase change temperature is provided for the phase change materialthrough the data line. Specifically, when the phase change materials inthe accommodating grooves 30 of light-emitting element setting regionsDD with the same waveband need to be subjected to phase change, the datalines are used for providing the phase change temperature, so that thephase change materials in the accommodating grooves 30 of thelight-emitting element setting regions DD corresponding to the datalines are subjected to phase change to finish the transfer of thelight-emitting elements with a corresponding waveband. Finally, n typesof light-emitting elements with different wavebands are all provided inthe accommodating grooves 30 of the corresponding light-emitting elementsetting regions DD. When a data signal needs to be written, a datawriting transistor T1 in the pixel driving circuit 60 is controlled by acontrol signal supplied from the scanning line SCAN to transmit the datasignal voltage supplied from the data line to the gate electrode of adrive transistor T2, so that the drive transistor T2 generates a drivingcurrent under the action of the data signal, a first power supply signalsupplied by a first power supply line and a second power supply signalsupplied by a second power supply line to drive the light-emittingelement to emit light. According to the technical solution, the arraysubstrate is multiplexed as the transfer substrate 100 and the data lineis multiplexed as the heating line 50, so that the transfer substrateand the heating line do not need to be individually provided, the costis reduced, and the process steps are simplified.

It should be noted that FIG. 16 merely shows one shape of the data line,but the shape does not constitute a limitation to the presentdisclosure, and a shape may be used as long as the data line can controlthe phase change of the phase change material in the correspondingaccommodating groove.

It can be understood that by way of example, the pixel driving circuit60 in FIG. 16 and FIG. 17 includes one capacitor and two thin filmtransistors, but such configuration does not constitute a limitation tothe present disclosure. In other optional embodiments, the pixel drivingcircuit 60 may also include one capacitor and seven thin filmtransistors, or the like.

Optionally, FIG. 18 is a schematic structural view of another transfersubstrate according to an embodiment of the present disclosure. As shownin FIG. 18, the array substrate further includes n first heating powersupply terminals V+ and n second heating power supply terminals V−; oneend of a heating line 50 corresponding to phase change materialsprovided in the accommodating grooves 30 of a same type of objectsetting region BB is connected to a same first heating power supplyterminal V+, and the other end of the heating line 50 corresponding tothe phase change materials provided in the accommodating grooves 30 ofthe same type of object setting regions is connected to a same secondheating power supply terminal V−.

Exemplarily, a plurality of object setting regions BB includes threetypes, that is, a first Micro LED setting region DD1, a second Micro LEDsetting region DD2 and a third Micro LED setting region DD3. The firstMicro LED setting region DD1 is used for transferring the first MicroLED, where the light-emitting color of the first Micro LED is a firstcolor, and the first color may be, for example, red. The second MicroLED setting region DD2 is used for transferring the second Micro LED,where the light-emitting color of the second Micro LED is a secondcolor, and the second color may be, for example, green. The third MicroLED setting region DD3 is used for transferring the third Micro LED,where the light-emitting color of the third Micro LED is a third color,and the third color may be, for example, blue. Accordingly, the arraysubstrate further includes three first heating power supply terminals V+and three second heating power supply terminals V−, that is, a redheating power supply terminal RV+ and a red heating power supplyterminal RV−, a green heating power supply terminal GV+ and a greenheating power supply terminal GV−, and a blue heating power supplyterminal BV+ and a blue heating power supply terminal BV−. The firstMicro LED setting region DD1, the second Micro LED setting region DD2,and the third Micro LED setting region DD3 are each provided with thephase change material 40. Specifically, when massive numbers of redMicro LEDs, green Micro LEDs and blue Micro LEDs need to be transferred,that is, the red Micro LEDs, the green Micro LEDs and the third MicroLEDs need to be placed in the accommodating grooves 30 of all the objectsetting regions BB, phase change signals are provided for the heatinglines 50 corresponding to all the first Micro LED setting regions DD1through the red heating power supply terminal RV+ and the red heatingpower supply terminal RV−, so that phase change materials 40 in theaccommodating grooves 30 of the first Micro LED setting regions DD1 aremade to be subjected to phase change, and the red Micro LEDs areprovided at one time in the accommodating grooves 30 of the first MicroLED setting regions DD1 to finish the transfer of the red Micro LEDs.Then, phase change signals are provided for the heating lines 50corresponding to all the second Micro LED setting regions DD2 throughthe green heating power supply terminal GV+ and the green heating powersupply terminal GV−, so that phase change materials 40 in theaccommodating grooves 30 of the second Micro LED setting regions DD2 aremade to be subjected to phase change, and the green Micro LEDs areprovided at one time in the accommodating grooves 30 of the second MicroLED setting regions DD2 to finish the transfer of the green Micro LEDs.Finally, phase change signals are provided for the heating lines 50corresponding to all the third Micro LED setting regions DD3 through theblue heating power supply terminal BV+ and the blue heating power supplyterminal BV−, so that phase change materials 40 in the accommodatinggrooves 30 of the third Micro LED setting regions DD3 are made to besubjected to phase change, and the blue Micro LEDs are provided at onetime in the accommodating grooves 30 of the third Micro LED settingregions DD3 to finish the transfer of the blue Micro LEDs. In this way,transfer of all the Micro LEDs are completed, that is, all Micro LEDs ofthree colors are transferred to the transfer substrate, thus improvingthe efficiency of massive transfer of Micro LEDs and ensuring relativelyhigh transfer yield.

Optionally, with continued reference to FIG. 18, the first heating powersupply terminal V+ and the second heating power supply terminal V− maybe multiplexed as pointing screen test terminals, and in a pointingscreen test phase, a pointing screen test signal is provided for thecorresponding sub-pixel via the first heating power supply terminal V+and the second heating power supply terminal V−.

Optionally, with continued reference to FIG. 18, a plurality of bondingpads 70 are further disposed between the first heating power sourceterminal V+ and the pixel driving circuit array; and each heating line50 is electrically connected to a corresponding first heating powersupply terminal V+ through a bonding pad 70. When the pointing screentest is completed, cutting is performed along a cutting line 80 so thatthe bonding pad 70 is disconnected from the first heating power sourceterminal V+, and the second heating power source terminal V− isdisconnected from the heating line 50. Then, electrical connection tothe driving chip or the flexible circuit board through a bonding pad 70is made, so that the driving chip or the flexible circuit board canprovide a corresponding signal for the pixel driving circuit 60 throughthe bonding pad 70.

Optionally, FIG. 19 is a schematic view of a film structure of anothertransfer substrate according to an embodiment of the present disclosure.As shown in FIG. 19, the pixel driving circuit array further includes aplurality of data lines; each of the plurality of data lines iselectrically connected to a respective column of pixel driving circuitsamong a plurality of columns of pixel driving circuits arranged in thearray; at least one heating line 50 is further included, and the heatingline 50 is located between the base substrate 10 and the blocking layer20, configured for controlling phase change of the phase changematerials 40, and located at the same layer as the data line 90.

Specifically, the heating line 50 and the data line 90 are disposed atthe same layer, so that the heating line 50 and the data line 90 can bemanufactured and formed in the same manufacturing process by using thesame mask plate instead of by using respective mask plates. Therefore,the number of mask plates used in the manufacturing method of the arraysubstrate can be reduced, the process cost is reduced, the process stepsare simplified, and the preparation efficiency is improved.

FIG. 19 exemplarily illustrates merely one thin film transistor of thepixel driving circuit 60, and it can be understood by those skilled inthe art that the pixel driving circuit 60 includes not only one thinfilm transistor, but also a capacitor, or the like. Configuration in thefollowing embodiment is also same as the configuration described above.Repetition will not be made here.

Optionally, the pixel driving circuit may include an active layer, afirst insulating layer, a first metal layer, a second insulating layerand a second metal layer successively located on a side of the basesubstrate. The first metal layer may form a gate electrode in the pixeldriving circuit, a scanning line, and a first electrode of a storagecapacitor; the second metal layer may form a source electrode, a drainelectrode, a data line and a power supply signal line in the pixeldriving circuit. Materials of the first insulating layer and the secondinsulating layer may include an oxide of silicon or a nitride ofsilicon, which is not limited in the embodiment of the presentdisclosure. The pixel driving circuit may further include a thirdinsulating layer and a third metal layer located between the first metallayer and the second insulating layer and stacked in a direction facingaway from the base substrate. The third metal layer is generally usedfor forming a reference voltage line and a second electrode of thestorage capacitor. The heating line may also be disposed at the samelayer as the gate electrode; or the heating line is disposed at the samelayer as the second electrode of the storage capacitor.

Based on the same inventive concept, the embodiment of the presentdisclosure further provides a display panel. FIG. 20 is a schematicstructural view of a display panel according to an embodiment of thepresent disclosure, FIG. 21 is a schematic view of a film structure of adisplay panel according to an embodiment of the present disclosure, FIG.22 is a schematic structural view of a display panel according to anembodiment of the present disclosure, and FIG. 23 is a schematic view ofa film structure of another display panel according to an embodiment ofthe present disclosure. As shown in FIGS. 20 and 21, a display panel 200includes an array substrate, a pixel driving circuit array located on aside of a base substrate 10′, and an insulating layer 20′ located on aside of the pixel driving circuit array facing away from the basesubstrate, where the array substrate includes the base substrate 10′,and the base substrate 10′ includes sub-pixel setting regions DD′arranged in an array. The pixel driving circuit array includes pixeldriving circuits 60′ arranged in an array, the insulating layer 20′forms accommodating grooves 30′ respectively within the sub-pixelsetting regions DD′, and the pixel driving circuits 60′ are disposed inone-to-one correspondence with accommodating grooves 30′. The displaypanel further includes data lines and heating lines. Each data line 90′is electrically connected to a respective column of pixel drivingcircuits 60′ among a plurality of columns of pixel driving circuits 60′arranged in the array. The data line 90′ is multiplexed as the heatingline. In a preparation stage, the data line 90′ serves as the heatingline to enable a light-emitting element to be transferred to theaccommodating groove 30′; and in a display stage, the data line 90′ isconfigured to provide a signal for the pixel driving circuit 60′ so thatthe pixel driving circuit 60′ is able to generate a current for drivingthe light-emitting element to emit light. Alternatively, as shown inFIGS. 20 and 21, the heating line 50′ and the data line 90′ are disposedat the same layer; in a phase change stage, the heating line 50′ enablesa light-emitting element to be transferred to the accommodating groove30′; and in a display stage, the data line 90′ is configured to providea signal for the pixel driving circuit 60′ so that the pixel drivingcircuit 60′ is able to generate a current for driving the light-emittingelement to emit light.

Specifically, in a preparation stage, the array substrate in the displaypanel 200 is multiplexed as the transfer substrate, and includes n typesof light-emitting element setting regions DD′ with different wavebands,and phase change materials are provided in accommodating grooves ofobject setting regions with at least (n−1) different wavebands. Whencorresponding light-emitting elements need to be provided in theaccommodating grooves 30′, phase change materials in the accommodatinggrooves 30′ of light-emitting element setting regions DD′ with the samewaveband are simultaneously subjected to phase change while phase changematerials in the accommodating grooves 30′ of light-emitting elementsetting regions DD′ with other wavebands are not subjected to phasechange, so that transfer of light-emitting elements of a correspondingwaveband is completed, and finally n types of light-emitting elementswith different wavebands are all provided in the accommodating grooves30′ of the corresponding light-emitting element setting regions DD′.That is, the light-emitting elements, for example, Micro LEDs, can bedirectly provided on the array substrate through one transfer. Massivetransfer of light-emitting elements is completed, the transfer steps aresimplified and the transfer efficiency is further improved. In thedisplay stage, since the light-emitting element has already beenprovided in the corresponding accommodating groove 30′, a data signalcan be provided for the driving circuit through the data line 90′ toenable the pixel driving circuit 60′ to generate a current for drivingthe light-emitting element to emit light.

Optionally, the material of the insulating layer 20′ may include, forexample, an organic material. Optionally, the material of the insulatinglayer 20′ may be, for example, photoresist. Since photoresist is acommonly used material in the display panel, it is not necessary toselect a specific material individually, thus reducing the preparationcost of the display panel. Optionally, with continued reference to FIG.20, a heating line 50′ includes a first portion 501′ and a secondportion 502′; a vertical projection of the second portion 502′ on aplane where the base substrate 10′ is located at least partiallyoverlaps a vertical projection of the accommodating groove 30′ on theplane where the base substrate 10′ is located. Alternatively, FIG. 24 isa schematic structural view of another display panel according to anembodiment of the present disclosure, and as shown in FIG. 24, at leastpart of a vertical projection of the second portion 502′ on a planewhere the base substrate 10′ is located surrounds a vertical projectionof the accommodating groove 30′ on the plane where the base substrate10′ is located.

Specifically, in the phase change stage, since the heating line 50′provides the phase change temperature for the phase change material, thesecond portion 502′ is disposed at a position of the accommodatinggroove 30′, i.e., directly above or directly below the phase changematerial or around the phase change material in the embodiment, so thatthe phase change speed of the phase change material is ensured and thetransfer speed is further improved.

It should be noted that by way of example, the data line 90′ is reusedas the heating line 50′ in FIG. 20, and the data line 90′ and theheating line 50′ are separately provided in FIG. 22, but suchconfiguration does not constitute a limitation to the presentdisclosure, and those skilled in the art can set the data line 90′ andthe heating line 50′ according to the actual situation. Optionally, adirect current voltage can be applied to the heating line so that theheating line can provide a phase change temperature. Since the currentin the same heating line is the same, the heating power can be providedthrough an increase in the resistance of the second portion of theheating line, thus improving the phase change speed of the phase changematerial.

Optionally, FIG. 25 is a schematic structural view of another displaypanel according to an embodiment of the present disclosure, and as shownin FIG. 25, a resistance per unit length of the second portion 502′ isgreater than a resistance per unit length of the first portion 501′.

Specifically, it can be seen from R=(ρL)/S that the area of thecross-section of the second portion 502′ on the plane perpendicular tothe column direction can be set to be smaller than the area of thecross-section of the first portion 501′ on the plane perpendicular tothe column direction so that the resistance per unit length of thesecond portion 502′ is greater than the resistance per unit length ofthe first portion 501′.

Optionally, with continued reference to FIG. 22, a shape of the verticalprojection of the second portion 502′ on the plane where the basesubstrate 10′ is located has at least one of a straight line, a brokenline, or a curved line.

Specifically, it can be seen from R=(ρL)/S that the length of the secondportion 502′ can be increased so that the resistance of the secondportion 502′ is greater than the resistance of the first portion 501′.

It should be noted that the embodiment does not specifically limit theshape of the second portion 502′, as long as the length of the secondportion 502′ can be increased. By way of example, the verticalprojection of the second portion 502′ on the plane where the basesubstrate 10′ is located has a shape of a broken line in FIG. 22. Inother optional embodiments, the shape of the vertical projection mayalso be spiral, for example, continued reference is made to FIG. 24 or26.

Based on the same inventive concept, the embodiment of the presentdisclosure further provides a transfer method. FIG. 27 is a flowchart ofa transfer method according to an embodiment of the present disclosure.As shown in FIG. 27, the method includes steps described below.

In S1, a transfer substrate is provided. The transfer substrate includesa plurality of object setting regions which are arranged in an array andconfigured to place objects to be placed, the plurality of objectsetting regions including n types, where n is a positive integer, andn≥2. The transfer substrate further includes: a base substrate, and ablocking layer located on a side of the base substrate, where theblocking layer forms accommodating grooves respectively within objectsetting regions. Phase change materials are provided in accommodatinggrooves of at least (n−1) types of object setting regions.

Phase change materials may be provided in accommodating grooves of (n−1)types of object setting regions. Phase change materials may also beprovided in accommodating grooves of all the n types of object settingregions. The phase change materials may be the same, i.e. the phasechange temperatures being the same, and may be different, but phasechange materials in the accommodating grooves of a same type of objectsetting regions need to be ensured to be the same.

In S2, phase change materials in accommodating grooves of an i-th typeof object setting regions are controlled to be subjected to phase changefrom a solid state to a liquid state or a gas state, and the transfersubstrate is placed in an i-th type of to-be-placed object suspension toenable an i-th third type of to-be-placed objects to fall into theaccommodating grooves corresponding to the phase change materialssubjected to the phase change to the liquid state or the gas state.

When phase change materials are provided in accommodating grooves of(n−1) types of object setting regions, the transfer substrate isdirectly placed in the to-be-placed object suspension having the sametype as the regions where no phase change material is placed. Theto-be-placed objects are placed in the liquid so that the damage to theto-be-placed objects caused by factors such as friction is avoided.Then, the to-be-placed objects can quickly fall, by means of, forexample, oscillation, into all the accommodating grooves where no phasechange material is provided. Thus, transfer of one third type ofto-be-placed objects is completed. Then, the phase change materials inthe accommodating grooves of the second type of to-be-placed objects aresubjected to phase change from a solid state to a liquid state or a gasstate. At this time, according to the above method, the second type ofto-be-placed object is also enabled to fall into the plurality ofaccommodating grooves where the phase change occurs to finish thetransfer of the second type of to-be-placed objects.

When phase change materials are provided in all accommodating grooves ofthe n types of object setting regions, the phase change materials in theaccommodating grooves of one type of object setting regions arecontrolled to be subjected to phase change from a solid state to aliquid state or a gas state, and the transfer substrate is placed in theto-be-placed object suspension having the same type as the one type sothat the to-be-placed objects fall into the accommodating groovescorresponding to the phase change materials subjected to the phasechange to the liquid state or the gas state.

It should be noted that the to-be-placed object falling into theaccommodating groove is not limited to placing the transfer substrate inthe i-th type of to-be-placed object suspension and performingoscillation, and a method may be used as long as the to-be-placed objectcan fall into the accommodating groove.

It can be understood that when the phase change material is subjected tophase change, it is necessary to ensure that the suspension is not asolid or a gas at the temperature during the whole working process.

In S3, the step S2 is circularly performed until corresponding types ofto-be-placed objects fall into all accommodating grooves of the ndifferent types of object setting regions, where i is a positive integerless than or equal to n.

In this way, the massive transfer of different types of to-be-placedobjects can be quickly achieved, the transfer period is shortened, andthe transfer efficiency is improved.

According to the transfer method provided in the embodiment of thepresent disclosure, phase change materials are provided in theaccommodating grooves of object setting regions, so that when noto-be-placed object needs to be transferred, the phase change materialsare provided in the accommodating grooves of the object setting regions,and when the to-be-placed objects need to be transferred, the phasechange materials in all the accommodating grooves of one type of objectsetting regions are subjected to phase change. At this time, a pluralityof to-be-placed objects corresponding to the one type of object settingregions can be provided at one time in the plurality of accommodatinggrooves in which phase change occurs, and other accommodating groovescannot be provided with to-be-placed objects due to the fact that phasechange materials are provided in these other accommodating grooves. Inthis way, transfer of one third type of to-be-placed objects at one timeis achieved, and finally all n types of to-be-placed objects are placedin the corresponding accommodating grooves. Through the transfersubstrate of the embodiment, massive transfer of different types ofto-be-placed objects can be quickly achieved, the transfer period isshortened, and the transfer efficiency is improved.

Optionally, when phase change materials in all the accommodating groovesare the same and the solid-liquid phase change temperature is, forexample, X° C., the transfer substrate is first heated to above X° C.,and the phase change materials are provided at all the accommodatinggrooves. Then, the transfer substrate is cooled to below X° C., and thephase change materials are solid, thereby completing the setting of thephase change materials. At this time, if to-be-placed objects aredesired to fall into the accommodating grooves, the to-be-placed objectsfail to be provided in the accommodating grooves since phase changematerials occupy the positions of the accommodating grooves. When phasechange materials in the accommodating grooves of one type of objectsetting regions need to be subjected to phase change to a liquid stateor a gas state, merely the phase change materials in the accommodatinggrooves of the one type of object setting regions are heated, and otherobject setting regions are not heated. In this way, the to-be-placedobjects can then fall into the accommodating grooves corresponding tothe phase materials from the solid state to the liquid state or the gasstate.

Optionally, when phase change temperatures of phase change materials inthe accommodating grooves of different types of object setting regionsare different, for example, a first phase change material and a secondphase change material are included, the solid-liquid phase changetemperature of the first phase change material is X° C., thesolid-liquid phase change temperature of the second phase changematerial is Y° C., and X is greater than Y, the transfer substrate isset in an environment of Z° C., where X is greater than Y and Y isgreater than Z. First phase change materials are dripped into theaccommodating grooves of the first type of object setting regions, andsince the temperature at the moment is lower than the first phase changetemperature, the first phase change materials are in a solid state.Then, second phase change materials are dripped into the accommodatinggrooves of the second type of object setting regions, and since thetemperature at the moment is lower than the second phase changetemperature, the second phase change materials are in a solid state.Thus, the setting of the phase change material is completed.

Optionally, when phase change temperatures of phase change materials inthe accommodating grooves of different types of object setting regionsare different, for example, a first phase change material and a secondphase change material are included, the solid-liquid phase changetemperature of the first phase change material is X° C., thesolid-liquid phase change temperature of the second phase changematerial is Y° C., and X is greater than Y, the transfer substrate isset in an environment of Z° C., where X is greater than Y and Y isgreater than Z. The second phase change materials are first set in theenvironment of Z° C., and thus the second phase change materials aresolidified. At this time, the solidified second phase change materialsare not only provided in the accommodating grooves of the type of objectsetting regions corresponding to the solidified second phase changematerials, but also provided in the accommodating grooves of the type ofobject setting regions not corresponding to the solidified second phasechange materials, that is, but also provided in the accommodatinggrooves of the type of object setting regions corresponding to the firstphase change materials. At this time, positions of the accommodatinggrooves of the type of object setting regions corresponding to the firstphase change materials are heated, so that the second phase changematerials are not solidified in the accommodating grooves of the type ofobject setting regions corresponding to the first phase changematerials. Therefore, the setting of the second phase change materialscan be completed. Then, the first phase change materials are provided inthe environment of Z° C. Since the solid second phase change materialshave been provided in the remaining accommodating grooves, the firstphase change materials are merely provided in the accommodating groovesof the type of object setting regions corresponding to the first phasechange materials, thus completing the setting of the first phase changematerials and the second phase change materials.

Optionally, different phase change materials can be provided in theaccommodating grooves of the corresponding object setting regions in aprinting manner. Optionally, different phase change materials can beprovided in the accommodating grooves of the corresponding objectsetting regions in a manner of 3D printing.

It can be understood that the above solution merely exemplarilyillustrates the manner in which the phase change material is provided inthe accommodating groove, but such manner does not constitute alimitation to the present disclosure, and a method may be used as longas the phase change material can be provided in the accommodatinggroove.

On the basis of the above solution, optionally, the phase changetemperatures of the phase change materials provided in the accommodatinggrooves of different types of object setting regions are different.

The step of controlling the phase change materials in the accommodatinggrooves of the i-th type of object setting regions to be subjected tothe phase change from the solid state to the liquid state or the gasstate, and placing the transfer substrate in the i-th type ofto-be-placed object suspension to enable the i-th third type ofto-be-placed objects to fall into the accommodating groovescorresponding to the phase change materials subjected to the phasechange to the liquid state or the gas state includes a step describedbelow.

At least one of a temperature of the base substrate, an ambienttemperature of the transfer substrate or a temperature of a to-be-placedobject suspension is controlled to enable the phase change materials inthe accommodating grooves of the i-th type of object setting regions tobe subjected to the phase change from the solid state to the liquidstate or the gas state, and the transfer substrate is placed in the i-thtype of to-be-placed object suspension to enable the i-th third type ofto-be-placed objects to fall into the accommodating groovescorresponding to the phase change materials subjected to the phasechange to the liquid state or the gas state.

It should be noted that the embodiment does not limit how to control thephase change of the phase change material, and a method may be used aslong as the i-th third type of to-be-placed objects can fall into theaccommodating grooves corresponding to the phase change materialssubjected to phase change.

Optionally, FIG. 28 is a flowchart of another transfer method accordingto an embodiment of the present disclosure. As shown in FIG. 28, themethod includes steps described below.

In S10, a transfer substrate is provided. The transfer substrateincludes a plurality of light-emitting element setting regions withdifferent wavebands arranged in an array, the plurality oflight-emitting element setting regions with different wavebandsincluding n types, where n is a positive integer, and n≥2. The transfersubstrate further includes: a base substrate, and a blocking layerlocated on a side of the base substrate, where the blocking layer formsaccommodating grooves respectively within the object setting regions.Phase change materials are provided in accommodating grooves of at least(n−1) types of light-emitting element setting regions.

n types of light-emitting element setting regions with differentwavebands are used for transferring light-emitting elements with nwavebands. The light-emitting element may include, for example, a MicroLED or a Mini LED. That is, a massive number of light-emitting elementsare transferred.

Phase change materials may be provided in accommodating grooves of (n−1)types of light-emitting element setting regions. Phase change materialsmay also be provided in accommodating grooves of n types oflight-emitting element setting regions. The phase change materials maybe the same, i.e. the phase change temperatures being the same, and maybe different, but phase change materials in the accommodating grooves ofa same type of light-emitting element setting regions need to be ensuredto be the same.

In S20, phase change materials in accommodating grooves of i-th-wavebandlight-emitting element setting regions are controlled to be subjected tophase change from a solid state to a liquid state or a gas state, andthe transfer substrate is placed in i-th-waveband light-emitting elementsuspension to enable light-emitting elements with an i-th waveband tofall into the accommodating grooves corresponding to the phase changematerials subjected to the phase change to the liquid state or the gasstate.

When phase change materials are provided in accommodating grooves of(n−1) types of light-emitting element setting regions, the transfersubstrate is directly placed in the light-emitting element suspensionhaving the same type as the regions where no phase change material isplaced. The light-emitting elements are placed in the liquid so that thedamage to the light-emitting elements caused by factors such as frictionis avoided. Then, the light-emitting elements can quickly fall, by meansof, for example, oscillation or the like, into all the accommodatinggrooves where no phase change material is provided. Thus, transfer ofone type of light-emitting element is completed. Then, the phase changematerials in the accommodating grooves of the second type oflight-emitting element are subjected to phase change from a solid stateto a liquid state or a gas state. At this time, according to the abovemethod, the second type of light-emitting element is also enabled tofall into the plurality of accommodating grooves where the phase changeoccurs to finish the transfer of the second type of light-emittingelement.

When phase change materials are provided in accommodating grooves of allthe n types of light-emitting element setting regions, the phase changematerials in the accommodating grooves of one type of light-emittingelement setting region are controlled to be subjected to phase changefrom a solid state to a liquid state or a gas state, and the transfersubstrate is placed in the light-emitting element suspension having thesame type as the one type so that the light-emitting elements fall intothe accommodating grooves corresponding to the phase change materials inthe liquid state or the gas state due to phase change.

It should be noted that the light-emitting element falling into theaccommodating groove is not limited to placing the transfer substrate inthe i-th type of light-emitting element suspension and performingoscillation, and a method may be used as long as the light-emittingelement can fall into the accommodating groove.

In S30, the step S20 is circularly performed until light-emittingelements with corresponding wavebands fall into all accommodatinggrooves of n types of light-emitting element setting regions withdifferent wavebands.

In this way, the massive transfer of different types of light-emittingelements can be quickly achieved, the transfer period is shortened, andthe transfer efficiency is improved.

On the basis of the above solution, optionally, after the light-emittingelements with corresponding wavebands fall into all the accommodatinggrooves of the different-waveband light-emitting element settingregions, the method further includes a step described below.

All light-emitting elements on the transfer substrate are transferred toan array substrate, where the array substrate includes a pixel drivingcircuit array.

The pixel driving circuit array includes pixel driving circuits arrangedin an array; and the pixel driving circuits are in one-to-onecorrespondence with the light-emitting elements.

Specifically, since the positions of the light-emitting elements withdifferent wavebands on the transfer substrate correspond to thepositions on the array substrate where the light-emitting elements needto be disposed, and the required light-emitting elements on the arraysubstrate correspond to the light-emitting elements on the transfersubstrate, the light-emitting elements with different wavebands can betransferred to preset positions on the array substrate at one timethrough the transfer substrate, and finally the massive transfer oflight-emitting elements can be achieved, and the transfer efficiency ishigh.

It is to be noted that the above are merely preferred embodiments of thepresent disclosure and the technical principles used therein. It is tobe understood by those skilled in the art that the present disclosure isnot limited to the specific embodiments described herein. Those skilledin the art can make various apparent modifications, adaptations andsubstitutions without departing from the scope of the presentdisclosure. Therefore, while the present disclosure has been describedin detail through the above-mentioned embodiments, the presentdisclosure is not limited to the above-mentioned embodiments and mayfurther include more other equivalent embodiments without departing fromthe concept of the present disclosure. The scope of the presentdisclosure is determined by the scope of the appended claims.

What is claimed is:
 1. A transfer substrate, comprising a plurality ofobject setting regions which are arranged in an array and configured toplace objects to be placed, the plurality of object setting regionscomprising n types, wherein n is a positive integer, and n≥2; whereinthe transfer substrate further comprises: a base substrate; a blockinglayer located on a side of the base substrate, wherein the blockinglayer forms accommodating grooves respectively within the plurality ofobject setting regions; and phase change materials provided inaccommodating grooves of at least (n−1) types of object setting regions.2. The transfer substrate of claim 1, wherein the plurality of objectsetting regions comprises n types of light-emitting element settingregions with different wavebands.
 3. The transfer substrate of claim 1,wherein in response to n≥3, phase change temperatures of phase changematerials provided in accommodating grooves of different types of objectsetting regions are different.
 4. The transfer substrate of claim 1,wherein no phase change material is provided in accommodating grooves ofa j-th type of object setting regions; wherein j is a positive integerless than or equal to n.
 5. The transfer substrate of claim 1, whereinphase change materials are provided in accommodating grooves of all ofthe n types of object setting regions; and phase change temperatures ofthe phase change materials in all the accommodating grooves are same. 6.The transfer substrate of claim 1, further comprising at least oneheating line, wherein the at least one heating line is configured tocontrol phase change of the phase change materials.
 7. The transfersubstrate of claim 6, wherein phase change of phase change materialsprovided in accommodating grooves of a same type of object settingregions is controlled by a same one of the at least one heating line. 8.The transfer substrate of claim 6, wherein phase change of phase changematerials provided in accommodating grooves of a same type of objectsetting regions, located in a same column or a same row, of theplurality of object setting regions arranged in the array is controlledby a same one of the at least one heating line.
 9. The transfersubstrate of claim 6, wherein each of the at least one heating linecomprises a first portion and a second portion; and a verticalprojection of the second portion on a plane where the base substrate islocated at least partially overlaps a vertical projection of anaccommodating groove on the plane where the base substrate is located;or at least part of a vertical projection of the second portion on aplane where the base substrate is located surrounds a verticalprojection of an accommodating groove on the plane where the basesubstrate is located.
 10. The transfer substrate of claim 9, wherein aresistance per unit length of the second portion is greater than aresistance per unit length of the first portion.
 11. The transfersubstrate of claim 9, wherein a shape of the vertical projection of thesecond portion on the plane where the base substrate is locatedcomprises at least one of a straight line, a broken line, or a curvedline.
 12. The transfer substrate of claim 2, further comprising a pixeldriving circuit array which is located between the blocking layer andthe base substrate; wherein the pixel driving circuit array comprisespixel driving circuits arranged in an array; and the pixel drivingcircuits are in one-to-one correspondence with accommodating grooves.13. The transfer substrate of claim 12, wherein the pixel drivingcircuit array further comprises a plurality of data lines; each of theplurality of data lines is electrically connected to a respective columnof pixel driving circuits among a plurality of columns of pixel drivingcircuits arranged in the array; and the plurality of data lines ismultiplexed as heating lines.
 14. The transfer substrate of claim 13,further comprising n first heating power supply terminals and n secondheating power supply terminals; one end of a heating line correspondingto phase change materials provided in accommodating grooves of a sametype of object setting regions is connected to a same first heatingpower supply terminal, and the other end of the heating linecorresponding to the phase change materials provided in theaccommodating grooves of the same type of object setting regions isconnected to a same second heating power supply terminal.
 15. Thetransfer substrate of claim 12, wherein the pixel driving circuit arrayfurther comprises a plurality of data lines; each of the plurality ofdata lines is electrically connected to a respective column of pixeldriving circuits among a plurality of columns of pixel driving circuitsarranged in the array; the pixel driving circuit array further comprisesat least one heating line; the at least one heating line is locatedbetween the base substrate and the blocking layer; and the at least oneheating line is configured to control phase change of the phase changematerials; and the at least one heating line is located at a same layeras the plurality of data lines.
 16. The transfer substrate of claim 1,wherein the phase change materials comprise one of water, disodiumhydrogen phosphate dodecahydrate, lauric acid, or calcium chloridehexahydrate.
 17. A display panel, comprising: an array substrate,wherein the array substrate comprises a base substrate, and the basesubstrate comprises a plurality of sub-pixel setting regions arranged inan array; a pixel driving circuit array located on a side of the basesubstrate; an insulating layer located on a side of the pixel drivingcircuit array facing away from the base substrate, wherein the pixeldriving circuit array comprises pixel driving circuits arranged in anarray; the insulating layer forms accommodating grooves respectivelywithin the plurality of sub-pixel setting regions; and the pixel drivingcircuits are disposed in one-to-one correspondence with theaccommodating grooves; and data lines and heating lines, wherein each ofthe data lines is electrically connected to a respective column of pixeldriving circuits among a plurality of columns of pixel driving circuitsarranged in the array; wherein the data lines are multiplexed as theheating lines; in a preparation stage, the data lines serve as theheating lines to enable light-emitting elements to be transferred to theaccommodating grooves; and in a display stage, the data lines areconfigured to provide signals for the pixel driving circuits so that thepixel driving circuits are able to generate currents for driving thelight-emitting elements to emit light; or wherein the heating lines andthe data lines are disposed at a same layer; in a phase change stage,the heating lines enable light-emitting elements to be transferred tothe accommodating grooves; and in a data writing phase, the data linesare configured to provide signals for the pixel driving circuits so thatthe pixel driving circuits are able to generate currents for driving thelight-emitting elements to emit light.
 18. The display panel of claim17, wherein each of the heating lines comprises a first portion and asecond portion; and a vertical projection of the second portion on aplane where the base substrate is located at least partially overlaps avertical projection of an accommodating groove on the plane where thebase substrate is located; or at least part of a vertical projection ofthe second portion on a plane where the base substrate is locatedsurrounds a vertical projection of an accommodating groove on the planewhere the base substrate is located.
 19. The display panel of claim 18,wherein a resistance per unit length of the second portion is greaterthan a resistance per unit length of the first portion.
 20. The displaypanel of claim 18, wherein a shape of the vertical projection of thesecond portion on the plane where the base substrate is locatedcomprises at least one of a straight line, a broken line, or a curvedline.